1. Features

Simultaneous inspection of multiple chips can be performed.

The chip detection range can be set flexibly and in detail.

The software can correspond to a variety of chip product types

Bad chips can be marked or removed.

The test results can be output in a file.                              Magnification range: 50X - 500X (max 1000x)

Eyepiece: High eye point wide angle plane PL10x/25mm

Observation head: Trinocular, 30 degree inclined infinity angle

Interpupillary Distance: 50mm – 76mm

Basic lens configuration:

BD 5x/0.15

BD 10x/0.30

BD 20x/0.40

BD 50x/0.55

Nozzle:

BD six-hole nosepiece with DIC slot

2. Check the content:

Line scan camera - chip connection check, tilt check, horizontal and vertical position check.
Face Cameras - Defilement, discoloration, foreign objects, cracks, shadows, scratches.

3. Target products:
Various crystal discs                                                              

4. Size: 5, 6, 8, 12 inch flat wafers.

5. Application:
Various wafers, LEDs, power devices, MEMS, LD, PD, semiconductor related. "